Wide Bandgap Testbed

Development of a Wide Bandgap Device and Module test-bed focusing on automated H3TRB, TDDB, and HTGB tests via embedded systems including SoC FPGA and micro-controllers.

Explore

Project Written and Presented Proposal

Full proposal to DOE PowerAmerica

Proposal Presentation to DOE PowerAmerica

Project Final Report

As the lead electronics engineer and local Principal Investigator at Group NIRE, I spearheaded the development of an advanced testing facility for Wide Bandgap (WBG) semiconductor devices. This project, in collaboration with Texas Tech University and funded by PowerAmerica, revolutionized reliability testing for next-generation power electronics.

This facility not only pushes the boundaries of WBG device characterization but also provides crucial services to manufacturers and end-users, accelerating the adoption of efficient, high-performance power electronics across various industries.

Project Showcase

Key Achievements

Designed and implemented multiple high-voltage test stands capable of evaluating devices up to 15 kV

Created custom PCBs and FPGA-based control systems for precise, automated testing

Developed innovative solutions for HTRB, HTGB, TDDB, short circuit, and other critical reliability tests

Integrated cutting-edge data acquisition and analysis systems for real-time monitoring and reporting

Key Contributions

Electronic Design and Embedded Systems:
- Designed and implemented FPGA-based control and data acquisition systems for multiple test stands, including HTRB, HTGB, and TDDB.
- Developed microcontroller-based solutions for test automation and control.
- Created custom high-voltage and high-current characterization equipment.
Test Stand Development:
- Led the design and implementation of several test stands, including High Temperature Reverse Bias (HTRB), High Temperature Gate Bias (HTGB), Time Dependent Dielectric Breakdown (TDDB)
- Contributed to the development of other test stands such as HTOL, Short Circuit, Surge Current, Avalanche, and di/dt.
Automation and Data Acquisition:
- Designed FPGA fabric to serve as the main acquisition, analysis, and interface platform for multiple test stands.
- Implemented software solutions for test automation, data collection, and analysis.
- Integrated National Instruments DAQ systems and developed LabVIEW interfaces for initial testing phases.
Project Management:
- Managed the project and personnel.
- Coordinated with Texas Tech University for collaborative aspects of the project.
- Oversaw equipment procurement, lab commissioning, and test planning.

Technical Highlights

High-Voltage Test Stand Development:

Designed and implemented test stands for evaluating devices up to 15 kV
Created custom HTRB tests for up to 6 kV devices at temperatures up to 200°C
Developed HTGB testing capability with bias voltages up to ±70 V
Developed TDDB test capability with gate bias up to ±70 V

Collaborated and managed advanced HTOL Testing:

Engineered an HTOL/switching test board for devices up to 3.3 kV and higher
Implemented an innovative boost-buck converter design for efficient power management
Integrated precise voltage and current measurement circuitry for accurate power loss calculation
Developed self-heating HTOL testing using junction temperature as feedback for converter switching frequency

Collaborated and managed enhanced Short Circuit Testing:

Designed a short circuit test board capable of testing devices up to 15 kV
Implemented parallel gate drivers supplying up to 6 A of gate drive current with rise/fall times less than 10 ns
Incorporated adjustable positive and negative gate voltage rails (up to ±25 V)
Developed a daughterboard solution to accommodate various device packages

Collaborated and managed Creation of Innovative dv/dt Testing:

Created a pulse compression board achieving dv/dt rates up to 660 V/ns into a 50 Ω load
Demonstrated >300 V/ns pulse on 600 V SiC diodes and >350 V/ns pulse on 1200 V SiC diodes
Designed with scalability to reach voltages up to 15 kV and dv/dt rates >500 V/ns

Collaborated and Managed Design of Advanced Surge Current Testing:

Developed a surge current testbed generating 50 Hz half-sine pulses with 10 ms pulse width
Achieved a maximum pulse current of 1.4 kA
Implemented programmable control for both repetitive and non-repetitive testing

Collaborated and Managed Design of Comprehensive Avalanche Testing:

Created separate avalanche testbeds for MOSFETs (up to 15 kV) and diodes (up to 1.5 kV, 35 A)
Designed with future scalability for 15 kV diode testing

Collaborated and Managed Design of di/dt Testing Solution:

Engineered a di/dt testbed capable of turn-on testing with max pulse current of 600 A

Created FPGA-based Control and Data Acquisition:

Designed a centralized FPGA-based system for test control, data acquisition, and analysis
Implemented real-time processing and decision-making capabilities
Developed a user-friendly interface for test configuration and monitoring

Collaborated and Managed Design of Custom High-Voltage and High-Current Characterization:

Contributed to developing a 30 kV / 10 mA high-voltage curve tracer
Assisted in creating a 500 A high-current curve tracer for comprehensive device characterization

Modular PCB Design:

Created custom PCBs with daughtercard configurations to support various device packages
Implemented specialized gate driver circuits for high-speed switching tests

Collaborated and Managed Design of Safety System Integration:

Designed PlexiGlass enclosures, safety interlocks, and grounding systems
Developed centralized safety control systems with alerts and automatic shutdowns

Environmental Testing Capabilities: